March 21: Japanet Backs LINK-US to Advance Ultrasonic Metal Bonding

March 21: Japanet Backs LINK-US to Advance Ultrasonic Metal Bonding

Japanet investment into LINK-US marks a clear push to scale ultrasonic metal bonding across Japan’s factories. Alongside Pegasus Tech Ventures, the pair committed ¥550 million within a ¥620 million round to develop high-frequency composite-vibration systems. The low-heat, low-impurity approach targets higher yields and lower power use in electronics and appliance assembly. For retail investors in Japan, the Japanet investment signals growing corporate-VC interest in advanced manufacturing tools set to shape production in 2026 and beyond.

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